President Lai Ching-te is calling for global cooperation in the semiconductor
industry to counter what he described as dumping practices by Chinese
suppliers.

Lai, at today's semiconductor forum, warned that Chinese firms are using
subsidies to undercut prices, threatening innovation and fair competition --
similar to tactics seen in steel and solar industries.

Lai emphasized Taiwan's global leadership in advanced chip manufacturing and
IC packaging but said it cannot sustain the sector’s growth alone.

He urged countries like the U-S, Japan, and Europe to work together in
building a stronger, more resilient semiconductor supply chain.

Government support, tax incentives, and international collaboration will be
key, Lai said, especially in the era of artificial intelligence.

His message was echoed by tech and diplomatic leaders from Taiwan, Japan, and
the U-S, all highlighting the need for shared talent development, technology
standards, and economic security.

(CNA_IG)